Changjiang Storage Launches Fourth Generation TLC 3D Flash X3-9070
According to insiders, the fourth generation products of Yangtze River Storage have reached 232 layers, which is comparable to international top tier manufacturers. Changjiang Storage stated that compared to the previous generation products, the X3-9070 has higher storage density, faster I/O speed, and adopts a 6-plane design, which improves performance while reducing power consumption, further unleashing the potential of system level products. It is reported that the new product achieves an I/O transfer rate of up to 2400MT/s in terms of performance, which complies with the ONFI5.0 specification; Compared to the previous generation of Yangtze River storage products, it achieved a 50% performance improvement; Thanks to the architecture innovation of Crystal Stack 3.0 in terms of density, the X3-9070 has become the highest density flash particle product in the history of Yangtze River Storage, capable of achieving 1Tb of storage capacity in smaller single chips; In terms of improving the system level product experience, thanks to the innovative 6-plane design, the X3-9070 improves its performance by more than 50% compared with the traditional 4-plane, while reducing its power consumption by 25% and significantly improving its energy efficiency ratio, which can bring more attractive Total cost of ownership (TCO) to end users.
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6-inch wafer ESD/TVS mass production
In 2015, 6-inch wafer ESD/TVS mass production was carried out, and in 2016, 8-inch wafer mass production reached a total of 6W pieces per year. In 2015, 6-inch wafer ESD/TVS mass production was carried out, and in 2016, 8-inch wafer mass production reached a total of 6W pieces per year
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